Home / Articles / Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films

Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films

Konstantin V. Feklistov
,  , 
Alexander A. Shklyaev
,  ,  ,  ,  , 
Alexey M. Pugachev 6
Alexey M. Pugachev
, 
Dmitriy G. Esaev 1
Dmitriy G. Esaev
1 Rzhanov Institute of Semiconductor Physics, Siberian Branch of the Russian Academy of Sciences, 13 Acad. Lavrentieva Ave., Novosibirsk 630090, Russian Federation
2 Budker Institute of Nuclear Physics, Siberian Branch of the Russian Academy of Sciences, 11 Acad. Lavrentieva Ave., Novosibirsk 630090, Russian Federation
3 Institute of Automation and Electrometry, Siberian Branch of the Russian Academy of Sciences, 1 Acad. Koptyug Ave., Novosibirsk 630090, Russian Federation
4 Novosibirsk State University, 1 Pirogova Str., Novosibirsk 630090, Russian Federation
5 Novosibirsk State Technical University, 20 Karla Marksa Ave., Novosibirsk 630073, Russian Federation
6 Academ Infrared LLC, 9 Uchenykh Str., Novosibirsk 630090, Russian Federation
Published 5 July 2023
Communication , Volume 9, Issue 2, 57-68
0
Share
Cite this
GOST
 | 
Cite this
GOST
Feklistov K. V. et al. Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films // Modern Electronic Materials. 2023. Vol. 9. No. 2. pp. 57-68.
GOST all authors (up to 50)
Feklistov K. V., Lemzyakov A. G., Shklyaev A. A., Protasov D. Y., Deryabin A. S., Spesivsev E. V., Gulyaev D. V., Pugachev A. M., Esaev D. G. Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films // Modern Electronic Materials. 2023. Vol. 9. No. 2. pp. 57-68.
RIS
 | 
Cite this
RIS
TY - JOUR
DO - 10.3897/j.moem.9.2.109980
UR - https://moem.colab.ws/publications/10.3897/j.moem.9.2.109980
TI - Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films
T2 - Modern Electronic Materials
AU - Feklistov, Konstantin V.
AU - Lemzyakov, Aleksey G.
AU - Shklyaev, Alexander A.
AU - Protasov, Dmitry Yu.
AU - Deryabin, Alexander S.
AU - Spesivsev, Evgeny V.
AU - Gulyaev, Dmitry V.
AU - Pugachev, Alexey M.
AU - Esaev, Dmitriy G.
PY - 2023
DA - 2023/07/05
PB - НИТУ МИСИС
SP - 57-68
IS - 2
VL - 9
ER -
BibTex
 | 
Cite this
BibTex (up to 50 authors)
@article{2023_Feklistov,
author = {Konstantin V. Feklistov and Aleksey G. Lemzyakov and Alexander A. Shklyaev and Dmitry Yu. Protasov and Alexander S. Deryabin and Evgeny V. Spesivsev and Dmitry V. Gulyaev and Alexey M. Pugachev and Dmitriy G. Esaev},
title = {Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films},
journal = {Modern Electronic Materials},
year = {2023},
volume = {9},
publisher = {НИТУ МИСИС},
month = {Jul},
url = {https://moem.colab.ws/publications/10.3897/j.moem.9.2.109980},
number = {2},
pages = {57--68},
doi = {10.3897/j.moem.9.2.109980}
}
MLA
Cite this
MLA
Feklistov, Konstantin V., et al. “Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films.” Modern Electronic Materials, vol. 9, no. 2, Jul. 2023, pp. 57-68. https://moem.colab.ws/publications/10.3897/j.moem.9.2.109980.
Views / Visits / Downloads
56 / 56 / 42

Keywords

band discontinuity
band structure
barrier
electrons
erbium
heterojunction
holes
indium oxide
injection
silicon
thermoemission
thin films

Abstract

In2O3 : Er films have been synthesized on silicon substrates by RF magnetron sputter deposition. The currents through the synthesized metal/oxide/semiconductor (MOS) structures (Si/In2O3 : Er/In-contact) have been measured for n and p type conductivity silicon substrates and described within the model of majority carrier thermoemission through the barrier, with bias voltage correction to the silicon potential drop. The electron and hole injection barriers between the silicon substrate and the film have been found to be 0.14 and 0.3 eV, respectively, by measuring the temperature dependence of the forward current at a low sub-barrier bias. The resulting low hole injection barrier is accounted for by the presence of defect state density spreading from the valence band edge into the In2O3 : Er band gap to form a hole conduction channel. The presence of defect state density in the In2O3 : Er band gap is confirmed by photoluminescence data in the respective energy range 1.55–3.0 eV. The band structure of the Si/In2O3 : Er heterojunction has been analyzed. The energy gap between the In2O3 : Er conduction band electrons and the band gap conduction channel holes has been estimated to be 1.56 eV.

References

1.
Sun C., Wade M.T., Lee Y., Orcutt J.S., Alloatti L., Georgas M.S., Waterman A.S., Shainline J.M., Avizienis R.R., Lin S., Moss B.R., Kumar R., Pavanello F., Atabaki A.H., Cook H.M., et. al.
Nature, 2015
2.
Atabaki A.H., Moazeni S., Pavanello F., Gevorgyan H., Notaros J., Alloatti L., Wade M.T., Sun C., Kruger S.A., Meng H., Al Qubaisi K., Wang I., Zhang B., Khilo A., Baiocco C.V., et. al.
Nature, 2018
4.
Liang D., Kurczveil G., Huang X., Zhang C., Srinivasan S., Huang Z., Seyedi M.A., Norris K., Fiorentino M., Bowers J.E., Beausoleil R.G.
Optical Fiber Technology, 2018
5.
Norman J.C., Jung D., Wan Y., Bowers J.E.
APL Photonics, 2018
6.
Jung D., Norman J., Wan Y., Liu S., Herrick R., Selvidge J., Mukherjee K., Gossard A.C., Bowers J.E.
Physica Status Solidi (A) Applications and Materials Science, 2018
7.
Jung D., Herrick R., Norman J., Turnlund K., Jan C., Feng K., Gossard A.C., Bowers J.E.
Applied Physics Letters, 2018
8.
Mukherjee K., Selvidge J., Jung D., Norman J., Taylor A.A., Salmon M., Liu A.Y., Bowers J.E., Herrick R.W.
Journal of Applied Physics, 2020
9.
High-temperature reliable quantum-dot lasers on Si with misfit and threading dislocation filters
Shang C., Hughes E., Wan Y., Dumont M., Koscica R., Selvidge J., Herrick R., Gossard A.C., Mukherjee K., Bowers J.E.
Optica, 2021
11.
Gruber J.B., Henderson J.R., Muramoto M., Rajnak K., Conway J.G.
Journal of Chemical Physics, 1966
12.
Ennen H., Schneider J., Pomrenke G., Axmann A.
Applied Physics Letters, 1983
13.
Polman A.
Journal of Applied Physics, 1997
14.
Kenyon A.J.
Semiconductor Science and Technology, 2005
15.
16.
Coffa S., Franzò G., Priolo F.
Applied Physics Letters, 1996
17.
Polman A., van den Hoven G.N., Custer J.S., Shin J.H., Serna R., Alkemade P.F.
Journal of Applied Physics, 1995
18.
Gusev O.B., Bresler M.S., Pak P.E., Yassievich I.N., Forcales M., Vinh N.Q., Gregorkiewicz T.
Physical Review B, 2001
19.
Priolo F., Franzò G., Coffa S., Carnera A.
Physical Review B, 1998
20.
21.
Bradley J.D., Pollnau M.
Laser and Photonics Reviews, 2010
23.
Krzyżanowska H., Ni K.S., Fu Y., Fauchet P.M.
Materials Science and Engineering B: Solid-State Materials for Advanced Technology, 2012
24.
Berencén Y., Illera S., Rebohle L., Ramírez J.M., Wutzler R., Cirera A., Hiller D., Rodríguez J.A., Skorupa W., Garrido B.
Journal Physics D: Applied Physics, 2016
25.
Zhu C., Lv C., Gao Z., Wang C., Li D., Ma X., Yang D.
Applied Physics Letters, 2015
28.
30.
Feklistov K.V., Lemzyakov A.G., Prosvirin I.P., Gismatulin A.A., Shklyaev A.A., Zhivodkov Y.A., Krivyakin G.К., Komonov A.I., Kozhukhov А.S., Spesivsev E.V., Gulyaev D.V., Abramkin D.S., Pugachev A.M., Esaev D.G., Sidorov G.Y., et. al.
Materials Research Express, 2020
31.
Bel Hadj Tahar R., Ban T., Ohya Y., Takahashi Y.
Journal of Applied Physics, 1998
33.
Höffling B., Schleife A., Fuchs F., Rödl C., Bechstedt F.
Applied Physics Letters, 2010
35.
Zhang X., Zhang Q., Lu F.
Semiconductor Science and Technology, 2007
36.
37.
Zhang D., Li C., Han S., Liu X., Tang T., Jin W., Zhou C.
Applied Physics Letters, 2002
38.
Weiher R.L., Ley R.P.
Journal of Applied Physics, 1966
39.
King P.D., Veal T.D., Fuchs F., Wang C.Y., Payne D.J., Bourlange A., Zhang H., Bell G.R., Cimalla V., Ambacher O., Egdell R.G., Bechstedt F., McConville C.F.
Physical Review B, 2009
40.
40. Kern W., Puotinen D.A. Cleaning solutions based on hydrogen peroxide for use in silicon semiconductor technology. RCA Review. 1970; 31: 187–206. https://www.americanradiohistory.com/ARCHIVE-RCA/RCA-Review/RCA-Review-1970-Jun.pdf
41.
41. Sze C.M. Physics of semiconductor devices. In 2 books. John Willey and Sons; 1981. Book 1. 456 p. (Russ. Transl. Zi S. Fizika poluprovodnikovykh priborov. V 2 kn. Moscow: Mir; 1984. Kn. 1. 456 p.)
42.
Lee M., Won Chel Choi, Eun Kyu Kim, Chun Keun Kim, Min S.
Thin Solid Films, 1996
43.
Liang C.H., Meng G.W., Lei Y., Phillipp F., Zhang L.D.
Advanced Materials, 2001
44.
Peng X.S., Meng G.W., Zhang J., Wang X.F., Wang Y.W., Wang C.Z., Zhang L.D.
Journal of Materials Chemistry A, 2002
45.
Mazzera M., Zha M., Calestani D., Zappettini A., Lazzarini L., Salviati G., Zanotti L.
Nanotechnology, 2007
46.
Kumar M., Singh V.N., Singh F., Lakshmi K.V., Mehta B.R., Singh J.P.
Applied Physics Letters, 2008
47.
Wei Z.P., Guo D.L., Liu B., Chen R., Wong L.M., Yang W.F., Wang S.J., Sun H.D., Wu T.
Applied Physics Letters, 2010