Home / Articles / Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators

Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators

, 
Linda Felsberg 1
Linda Felsberg
, 
Gerald Gerlach 1
Gerald Gerlach
1 Technische Universität Dresden, Solid State Electronics Laboratory, 01062 Dresden, Germany
10.3897/j.moem.4.2.33391
Published 1 June 2018
Communication , Volume 4, Issue 2, 59-69
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Suchaneck G., Felsberg L., Gerlach G. Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators // Modern Electronic Materials. 2018. Vol. 4. No. 2. pp. 59-69.
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Suchaneck G., Felsberg L., Gerlach G. Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators // Modern Electronic Materials. 2018. Vol. 4. No. 2. pp. 59-69.
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TY - JOUR
DO - 10.3897/j.moem.4.2.33391
UR - https://moem.colab.ws/publications/10.3897/j.moem.4.2.33391
TI - Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators
T2 - Modern Electronic Materials
AU - Suchaneck, Gunnar
AU - Felsberg, Linda
AU - Gerlach, Gerald
PY - 2018
DA - 2018/06/01
PB - НИТУ МИСИС
SP - 59-69
IS - 2
VL - 4
ER -
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@article{2018_Suchaneck,
author = {Gunnar Suchaneck and Linda Felsberg and Gerald Gerlach},
title = {Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators},
journal = {Modern Electronic Materials},
year = {2018},
volume = {4},
publisher = {НИТУ МИСИС},
month = {Jun},
url = {https://moem.colab.ws/publications/10.3897/j.moem.4.2.33391},
number = {2},
pages = {59--69},
doi = {10.3897/j.moem.4.2.33391}
}
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Suchaneck, Gunnar, et al. “Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators.” Modern Electronic Materials, vol. 4, no. 2, Jun. 2018, pp. 59-69. https://moem.colab.ws/publications/10.3897/j.moem.4.2.33391.
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Keywords

cooling power
electrocaloric cooling
heat transfer
heat transfer fluids
thermal resistance

Abstract

Materials properties affecting EC device operation are discussed based on an analytically tractable model of a layered EC refrigerator. Special attention was paid to thermal and interface thermal resistances. Estimates of the average cooling power of a stacked MEMS-based EC refrigerator were made.

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