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Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders

,  ,  , 
Vladimir G. Kurbatov 2
Vladimir G. Kurbatov
, 
Anna A. Gavrilova 1
Anna A. Gavrilova
, 
1 National Research University of Electronic Technology, 1 Shokin Sq., Zelenograd, Moscow 124498, Russian Federation
2 Federal Research Center of Problem of Chemical Physics and Medicinal Chemistry RAS, 1 Acad. Semenov Ave., Chernogolovka, Moscow Region 142432 Russian Federation
10.3897/j.moem.11.3.143013
Published 10 October 2025
Communication , Volume 11, Issue 3, 181-195
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Belyakov I. A. et al. Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders // Modern Electronic Materials. 2025. Vol. 11. No. 3. pp. 181-195.
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Belyakov I. A., Kochergin M. D., Solovyov I. A., Kurbatov V. G., Gavrilova A. A., Vertyanov D. V. Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders // Modern Electronic Materials. 2025. Vol. 11. No. 3. pp. 181-195.
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TY - JOUR
DO - 10.3897/j.moem.11.3.143013
UR - https://moem.colab.ws/publications/10.3897/j.moem.11.3.143013
TI - Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
T2 - Modern Electronic Materials
AU - Belyakov, Igor A.
AU - Kochergin, Mikhail D.
AU - Solovyov, Ilya A.
AU - Kurbatov, Vladimir G.
AU - Gavrilova, Anna A.
AU - Vertyanov, Denis V.
PY - 2025
DA - 2025/10/10
PB - НИТУ МИСИС
SP - 181-195
IS - 3
VL - 11
ER -
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@article{2025_Belyakov,
author = {Igor A. Belyakov and Mikhail D. Kochergin and Ilya A. Solovyov and Vladimir G. Kurbatov and Anna A. Gavrilova and Denis V. Vertyanov},
title = {Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders},
journal = {Modern Electronic Materials},
year = {2025},
volume = {11},
publisher = {НИТУ МИСИС},
month = {Oct},
url = {https://moem.colab.ws/publications/10.3897/j.moem.11.3.143013},
number = {3},
pages = {181--195},
doi = {10.3897/j.moem.11.3.143013}
}
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Belyakov, Igor A., et al. “Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders.” Modern Electronic Materials, vol. 11, no. 3, Oct. 2025, pp. 181-195. https://moem.colab.ws/publications/10.3897/j.moem.11.3.143013.
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Keywords

3D integration
packaging
polyimide
redistribution layer

Abstract

The article describes the preparing process for composites with a polyimide varnish PILK-2B matrix, which filled with particles of technical diamond, copper oxide, cubic boron nitride and hexagonal boron nitride for use in redistribution layers during chip packaging. Article show the results of the adhesive properties study for these composites with various fillers in relation to alkali glass and ST50 sitall substrates using the pull-off method. The measurement showed that the maximum adhesion to sitall and glass substrates is characteristic of the composite based on cubic boron nitride. It is 20.97 MPa and 20.11 MPa, respectively. Composites based on technical diamond and hexagonal boron nitride show lower adhesion – 17.48 and 18.03 MPa for sitall, 17.27 and 16.84 for glass. The material based on copper oxide show a significant difference in adhesion for sitall and glass – 14.78 MPa and 19.65 MPa, respectively. In addition, the article presents the results of composite processing using infrared nanosecond laser ablation to obtain structures in the form of traces and cylinders (contact pads) of various sizes. Cubic boron nitride based composites show clearest pattern with minimum line/space parameter of 25 µm and minimum delamination. Composite based on hexagonal boron nitride show the worst result with the maximum number of damages and flakes during laser treatment.

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